濟(jì)南紙箱瓦楞紙板生產(chǎn)中總會(huì)出現(xiàn)裝不好的問(wèn)題，每家工廠都會(huì)出現(xiàn)這樣的問(wèn)題，只是看誰(shuí)控制的好。但這是一個(gè)許多紙箱廠經(jīng)營(yíng)者認(rèn)為是膠水的問(wèn)題。其實(shí)，紙板的粘合不一定是膠水的問(wèn)題。它可以是人員操作、紙張、設(shè)備，甚是糊化溫度和粘度、機(jī)器溫度。我們來(lái)分析一下這些原因。
Jinan carton corrugated board production will always have the problem of poor packing, every factory will have such a problem, just to see who controls it well. But this is a problem that many carton factory operators think is glue. In fact, the adhesion of cardboard is not necessarily the problem of glue. It can be personnel operation, paper, equipment, even gelatinization temperature and viscosity, machine temperature. Let's analyze these reasons.
在操作中，調(diào)整膠量的間隙大小是非常重要的。當(dāng)膠量不足時(shí)，會(huì)導(dǎo)致粘接不良，導(dǎo)致配合不良。在操作中由于沒(méi)有及時(shí)檢查發(fā)現(xiàn)，所以廢品率高。從操作面看，上膠量主要是上膠間隙的調(diào)節(jié)問(wèn)題，只要控制在合理范圍內(nèi)就可以控制板材的粘接。
In operation, it is very important to adjust the gap size of glue quantity. When the amount of glue is insufficient, it will lead to poor adhesion and poor matching. In operation, the rejection rate is high due to no timely inspection. From the operation point of view, the amount of gluing is mainly the adjustment of the gluing gap. As long as the control is within a reasonable range, the bonding of the plate can be controlled.
當(dāng)紙張吸水時(shí)也會(huì)導(dǎo)致附著力差，紙張吸水膠很難滲透到紙張中，這種現(xiàn)象容易出現(xiàn)的就是假附著力。當(dāng)紙張吸水時(shí)必須增加膠水的用量，提高紙張的溫度。提高紙張的溫度可以分解纖維，使膠水更易滲透。
When the paper absorbs water, it will also lead to poor adhesion. It is difficult for the paper absorbent to penetrate into the paper, and the most likely phenomenon is false adhesion. When the paper absorbs water, the amount of glue must be increased to raise the temperature of the paper. Increasing the temperature of the paper can decompose the fibers and make the glue more permeable.
當(dāng)設(shè)備在生產(chǎn)過(guò)程中出現(xiàn)間隙跳動(dòng)或不平衡時(shí)，會(huì)導(dǎo)致粘結(jié)力差，所以工廠需要定期對(duì)每個(gè)間隙進(jìn)行校準(zhǔn)，如膠輥、壓輥等。
When there is gap runout or imbalance in the production process of the equipment, it will lead to poor adhesion, so the factory needs to calibrate every gap regularly, such as rubber roll, pressure roll, etc.
紙板粘合不一定是溫度不夠引起的。我們從紙板加熱溫度分析,因?yàn)槿龑雍臀鍖拥暮穸鹊陌宥际遣煌?那么同樣的溫度終于轉(zhuǎn)移到紙板的焊接點(diǎn)溫度是不同的,因?yàn)槲鍖影宓暮穸?同樣的加熱溫度,焊接點(diǎn)的溫度低于三層板。
Board bonding is not necessarily caused by insufficient temperature. From the analysis of cardboard heating temperature, because the thickness of three layers and five layers are different, then the same temperature finally transferred to the cardboard welding point temperature is different, because the thickness of five layers, the same heating temperature, the temperature of welding point is lower than three layers.
